A new kind of technical conference and trade show, developed for and by the high-frequency/high-speed electronics industry and Microwave Journal China.
The Electronic Design Innovation Conference provides an opportunity for design engineers and system integrators to learn about the latest RF/microwave and high speed digital products and technologies for today’s communication, computing, RFID, industrial wireless monitoring, navigation, aerospace and related markets.
With a focus on applications, emerging technologies and practical engineering solutions, this annual event brings together the designers at the forefront of Chinese innovation and the world’s leading multi-national technology companies.
The HF/HS Electronic Design Innovations Conference includes keynotes presentations from industry executives and government officials, technical presentations, workshops, expert panels, exhibitor showcase and networking reception.
The 2 ½ day inaugural event will be held March 12-14, 2013 in Beijing, China. Visit: EDI CON 2013
